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Phone: +86 16626708626Description
Product Model: IC694ACC310AGE
Product Brand: GE Fanuc (Emerson Automation)
Product Series: PACSystems RX3i Accessory
Product Features:
• Blank slot filler module designed for RX3i PACSystems PLC racks
• Protects unused slots from contamination, vibration, and mechanical damage
• Easy insert/remove design compatible with main and expansion baseplates
• Helps maintain organized rack layout and system integrity
Technical Specifications
| Specification | Details |
|---|---|
| Model Number | IC694ACC310AGE |
| Product Type | Blank Slot Filler Module |
| Compatible System | GE PACSystems RX3i Rack |
| Backplane Integration | Mechanical only (no electrical connection) |
| Slot Coverage | Single standard module slot |
| Weight | Approx. 0.20–0.25 lbs (≈90–110 g) |
| Protection Function | Dust, vibration, liquid splash prevention |
| Mounting | Tool-free rack installation |
| Electrical Draw | None |
| LED/Status Indicators | None |
| Material | Industrial-grade thermoplastic |
- IC694ACC310AGE
Product Role & System Fit
Industrial automation control systems, especially rack-based architectures, rely on precise physical and electrical layout to maximize uptime and long-term reliability. In the GE PACSystems RX3i ecosystem, control modules, I/O cards, and communication interfaces share a backplane-powered rack with strict electrical and environmental requirements. The IC694ACC310AGE is a blank slot filler accessory designed to occupy unused rack slots in this environment.
Unlike active I/O modules or processor units, the IC694ACC310AGE does not process signals, execute logic, or interface with field devices. Its role is purely mechanical and protective: by covering vacant slots, it prevents dust, moisture, and foreign objects from entering the backplane and possibly causing intermittent faults. It also helps maintain the mechanical stability of adjacent active modules — when heavy components vibrate due to mechanical stress or rack movement, empty slots can act as weak points. Filling them with a dedicated filler like the IC694ACC310AGE maintains rack rigidity and prolongs module life.
Integration into a PACSystems RX3i rack is straightforward. The module matches the physical form factor of standard RX3i I/O modules and snaps into place without special tools. It requires no configuration, firmware, or programming, and can be installed or removed under power (although service technicians typically power down the rack to avoid adjacent module movement). Because the filler imposes zero current draw and makes no connection to the backplane’s signal layers, it has negligible impact on system operation while providing significant protective benefits.
Whether you’re completing a new control cabinet build or tidying up a retrofit with spare expansion potential, the IC694ACC310AGE plays a small but essential role in preserving the integrity of an RX3i PACSystems installation.
