GE IC695CHS012-CR 12-Slot Universal Backplane

Description

In PACSystems RX3i automation architectures, selecting the right backplane is foundational to system scalability, module compatibility, and long-term maintainability. When designing or expanding control racks that mix high-performance PCI-based modules (like advanced CPUs, Ethernet interfaces, or HART analog I/O) with legacy serial I/O (IC694 series), a universal backplane ensures seamless integration without forcing compromises on slot usage, hot-swap capability, or bus performance. Limited slot counts or non-universal designs can constrain rack density, complicate future upgrades, or require additional expansion hardware—adding cost, wiring, and potential points of failure in distributed or high-I/O-count applications.

GE IC695CHS012-CR (a revision-specific variant of the IC695CHS012, often denoting manufacturing updates, testing, or packaging under Emerson) serves as the 12-slot universal backplane in the RX3i family. It provides the mechanical mounting, power distribution, and dual-bus communication backbone (PCI for IC695 modules and high-speed serial for IC694) needed to house a complete controller and I/O subsystem in one rack. This backplane becomes essential for engineers building mid-to-large systems where maximizing local I/O density, supporting hot insertion/removal, and enabling mixed-module configurations directly impact installation efficiency, downtime reduction, and adaptability to evolving process requirements in industrial automation.

The GE IC695CHS012-CR functions as the primary mounting and interconnect platform for RX3i PACSystems, accommodating up to 12 modules in a single rack. It features a dual-bus architecture: high-speed PCI bus for IC695-series modules (CPUs, Ethernet, advanced analog) and serial bus for IC694-series I/O, allowing flexible placement without dedicated slots for each type. A built-in terminal strip on the left (slot 0) provides isolated 24 VDC input for powering field devices or modules, while an integral grounding bar connects module shields and rack ground points to minimize noise and ensure safety compliance.

Power and signals distribute across the backplane rails, supporting hot-swap of most modules to enable maintenance without system shutdown in non-redundant setups. The backplane includes status indicators and fault reporting to the CPU, plus provisions for proper grounding and shielding. In the RX3i stack, GE IC695CHS012-CR typically mounts as the main/local rack (wall or DIN-rail in enclosures), with expansion possible via serial or Ethernet-linked remote bases. It integrates natively with RX3i CPUs (CPE3xx series) for deterministic I/O scanning, supporting protocols like PROFINET, Ethernet/IP, or Modbus TCP through attached interfaces—all while preserving high-speed data exchange and module diagnostics.

GE IC695CHS012-CR delivers practical value through its universal design, allowing full utilization of 12 slots for any mix of RX3i modules—maximizing I/O density in a single footprint and reducing the need for multiple racks or remote expansions in space-constrained cabinets. Hot-swap support minimizes production interruptions during module replacement or upgrades, while the dual-bus architecture future-proofs systems by accommodating both legacy IC694 I/O and modern IC695 high-performance components without adapters or rewiring.

The integrated grounding bar and isolated 24 VDC terminal strip enhance electrical integrity, reducing noise-induced errors in analog or communication loops and simplifying field power distribution. For RX3i users scaling from smaller racks or migrating from older platforms, GE IC695CHS012-CR streamlines engineering by providing ample expansion headroom, consistent backplane performance, and reliable diagnostics—contributing to higher system availability, easier troubleshooting, and lower lifecycle costs in demanding automation environments.

GE IC695CHS012-CR is routinely deployed in oil & gas or petrochemical facilities for central control racks aggregating high-density analog/digital I/O with advanced Ethernet communications, supporting continuous process monitoring in expansive plants. In manufacturing or automotive assembly lines, it houses mixed I/O for machine control, vision systems, and safety modules, where slot flexibility and hot-swap enable quick reconfiguration during line changes. Water/wastewater, power utilities, or chemical processing sites use it for distributed panels with substantial field signals, prioritizing rack density, noise immunity, and uptime in harsh or remote process control environments.

Related or compatible products in the PACSystems RX3i family include:

• IC695CHS012 – Standard/base version (functionally identical; -CR denotes a specific revision or variant).
• IC695CHS016 – 16-slot universal backplane for even higher density in larger systems.
• IC694CHS398 – 5-slot serial expansion backplane for remote or smaller distributed I/O.
• IC695PSA040 – Recommended 40 W power supply module that mounts in slot 0 or 1 on this backplane.
• IC695CPE330 – High-performance RX3i CPU that leverages the full capabilities of GE IC695CHS012-CR in demanding applications.
• IC695ETM001 – Ethernet interface module for network connectivity in racks using this backplane.
• IC694MDLxxx / IC695ALGxxx series – Compatible serial (IC694) or PCI (IC695) I/O modules that populate the slots.
• IC695ACC400 – Rack mounting accessories or fillers for unused positions.

Before installing GE IC695CHS012-CR, verify enclosure space accommodates the dimensions and ventilation requirements (0–60 °C ambient with adequate airflow). Mount securely to panel or DIN rail, ensuring proper earth grounding via the integral bar to all module shields and facility ground—critical for noise rejection. Connect the isolated 24 VDC terminal strip if field power distribution is needed, and confirm power supply compatibility (e.g., IC695PSA040 or higher) matches the total module load via Emerson’s power budget tool.

For ongoing maintenance, inspect grounding connections and terminal strip wiring annually for corrosion or looseness, especially in humid or corrosive sites. Monitor system diagnostics through the CPU for backplane faults or module insertion issues. During planned outages, visually check bus connectors for dust/debris and reseat modules if needed. No firmware applies to the backplane itself, but keep spares on hand for rapid replacement in critical racks—hot-swap minimizes impact when swapping under power.