WhatsApp: +86 16626708626
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Phone: +86 16626708626Description
Product Model: IC695CHS016
Product Brand: GE (General Electric / GE Fanuc / Emerson Automation)
Product Series: PACSystems RX3i
Product Features:
- 16-slot modular backplane for PACSystems RX3i controllers and I/O modules
- High-speed communication between CPU and I/O modules
- Rugged industrial-grade chassis for reliable long-term use
- Compatible with a wide range of GE PACSystems RX3i and Series 90 modules
- IC695CHS016
- IC695CHS016
| Specification | Description |
|---|---|
| Model | IC695CHS016 |
| Brand | GE (General Electric / GE Fanuc / Emerson Automation) |
| Series | PACSystems RX3i |
| Type | 16-slot modular backplane chassis |
| Slots | 16 total, compatible with RX3i/90-30/90-70 modules |
| Slot Spacing | Standard RX3i spacing (33 mm/module width) |
| Data Bus | High-speed PCI-style backplane |
| Material | Industrial-grade metal frame |
| Mounting | DIN rail or panel mounting supported |
| Operating Temperature | 0 °C to 60 °C |
| Storage Temperature | -40 °C to 85 °C |
| Weight | 2.1 kg (approx.) |
| Indicators | None (module-level LEDs are on individual I/O modules) |
| Compliance | CE, UL, RoHS |
