LAM 810-800081-022 P2MB VME Etch PCB

Description

Key Technical Specifications

Parameter	Value
Manufacturer	LAM Research
Part Number	810-800081-022
Board Identification	P2MB / VME Etch
Product Type	PCB Assembly / Motherboard
Bus Architecture	VME
Application	LAM semiconductor etch equipment
System Role	VME backplane / module interconnect
Board Revision	Verify from physical board label
Compatible Modules	Verify against the specific LAM equipment configuration
Power Requirements	Equipment-specific; verify service documentation
Mechanical Dimensions	Not sufficiently verified from OEM documentation
Connector Configuration	Verify against installed board
Firmware	Not established as a board-level specification
Condition	New Original / New Surplus / Refurbished — confirm actual unit

Technical verification note: Public sources disagree on some detailed specifications. One listing calls the part a VMEbus Analog I/O PCBA, another identifies it as a P2MB VME motherboard, and another lists it specifically as a VME BackPlane PCB.

For procurement, the safest identification is the exact LAM 810-800081-022 part number plus the physical board marking. Do not rely on unsupported claims such as specific ADC/DAC resolution, channel count, operating voltage, or hot-swap capability.

 

Product Introduction

The LAM Research 810-800081-022 is a P2MB/VME PCB assembly associated with LAM Research VME-based etch equipment. Multiple industrial parts sources identify the assembly as a P2MB VME Etch board or VME backplane PCB.

This is a system-specific board, not a generic VME replacement card. Before ordering, match the complete part number, board revision, connector arrangement, and the target LAM tool configuration. A related part number such as 810-800081-018 should not be treated as interchangeable without documentation.

Installation & Configuration Guide

 

Stage 1: Pre-Installation Preparation — 10–15 Minutes

⚠️ Safety First: Follow the LAM equipment maintenance procedure and site lockout/tagout procedure. Do not remove a VME board from an energized chassis unless the applicable equipment documentation explicitly permits it.

Tools Required

• ESD wrist strap
• ESD-safe work surface
• Appropriate screwdriver set
• Digital multimeter
• Connector labels
• Smartphone/camera
• LAM equipment service documentation

Data Backup

Before removal:

1. Record 810-800081-022 from the existing board label.
2. Photograph the entire installed board.
3. Photograph all connector locations.
4. Record the board revision.
5. Photograph jumpers, switches, and configuration links.
6. Document the slot position of every installed VME module.
7. Record cable routing and harness identification.

Keep the old board until the replacement has passed system-level testing.

 

Stage 2: Removing the Old Board — 5–10 Minutes

1. Place the LAM tool in its approved maintenance state.
2. Complete electrical isolation and verify the safe state.
3. Apply ESD protection.
4. Remove any required chassis cover or access panel.
5. Label connected harnesses.
6. Disconnect connectors without pulling on the wires.
7. Release the board’s retaining hardware.
8. Carefully withdraw the PCB from the VME assembly.
9. Inspect the connector pins and mating backplane for damage or contamination.

⚠️ Do not force the board. VME connectors can require considerable insertion force, and misalignment can damage connector contacts.

 

Stage 3: Installing 810-800081-022 — 10 Minutes

1. Verify the Replacement

Confirm:

• Part number: 810-800081-022
• Board identification: P2MB / VME Etch
• Revision marking
• Connector arrangement
• Mechanical dimensions
• Mounting hardware

2. Compare Against the Removed Board

Place both assemblies side by side.

Check:

• PCB layout
• Connector positions
• Connector labels
• Jumper settings
• Switch settings
• Revision markings
• Mounting points
• Daughter-board interfaces

3. Install

1. Align the board with the chassis guides.
2. Ensure the PCB is correctly aligned with the VME connector.
3. Push the board straight into position.
4. Confirm full connector engagement.
5. Secure the retaining hardware.
6. Reconnect harnesses according to your photographs and labels.

Self-Checklist

• Exact part number confirmed
• Board revision checked
• Slot position confirmed
• Connector alignment verified
• Harnesses correctly identified
• Jumpers/switches copied where applicable
• Board retaining hardware secured

 

Stage 4: Power-On & Testing — 10–20 Minutes

Pre-Power Check

Inspect:

1. VME connectors
2. PCB edge contacts
3. Harness connections
4. Mounting hardware
5. Foreign material
6. Signs of corrosion or component damage

Use the equipment documentation to verify applicable supply rails before energizing.

Power-Up

1. Restore power according to the LAM maintenance procedure.
2. Observe chassis and controller status indicators.
3. Confirm VME system initialization.
4. Verify communication with installed VME modules.
5. Check for controller or chassis diagnostics.
6. Run the equipment’s approved operational test.
7. Verify the affected process functions before returning the tool to production.

Troubleshooting

System fails to initialize:
Check board seating, VME connector engagement, slot assignment, power rails, and board revision.

Downstream VME module is not detected:
Inspect the affected slot and backplane connection. Compare the installed configuration with the original photographs.

Intermittent communication:
Inspect connector seating and mechanical alignment first. Then check the applicable VME bus diagnostics.

Replacement appears electrically correct but the tool will not boot:
Stop repeated power cycling. Verify the exact board revision and LAM tool configuration before proceeding.

 

Frequently Asked Questions (FAQ)

What is LAM 810-800081-022?

Public industrial parts sources identify 810-800081-022 as a LAM Research P2MB/VME Etch PCB, with some sources specifically calling it a VME backplane PCB.

Is 810-800081-022 a VME motherboard or backplane?

The terminology varies between suppliers. One source identifies it as a motherboard, while another lists it as a VME BackPlane PCB.

For purchasing purposes, use the exact 810-800081-022 assembly number and the physical board label rather than relying on the generic term “motherboard” or “backplane.”

Is 810-800081-022 compatible with 810-800081-018?

Do not assume compatibility. A parts catalog separately lists 810-800081-018 REV.B P2 MB VME ETCH and 810-800081-022 VME BackPlane PCB as different part numbers.

Verify the LAM tool model, board revision, connector arrangement, and service documentation before substituting either part.

Can this board be hot-swapped?

Do not assume it can. The public sources reviewed do not establish a verified hot-swap specification for 810-800081-022. Follow the LAM equipment maintenance procedure unless hot replacement is explicitly documented.

Is LAM 810-800081-022 obsolete?

The sources reviewed do not provide a reliable OEM lifecycle statement establishing its current official lifecycle status. Treat it as a legacy/field-service part for procurement purposes and verify actual stock and condition with the supplier.

Why do online specifications for this part conflict?

This is important. Some third-party listings attribute analog I/O specifications to 810-800081-022, while other sources identify it as the /VME Etch motherboard or backplane.

I would not publish unsupported claims such as “16-channel analog I/O,” “16-bit ADC/DAC,” or a specific supply voltage as definitive specifications for this part without the OEM drawing or a verified board photograph.

What should I send a supplier when requesting this part?

Provide:

• LAM 810-800081-022
• Photo of the existing board label
• Board revision
• LAM equipment/tool model
• Photo of the connector side
• Required quantity
• Required condition: New Original, New Surplus, or Refurbished
• Required delivery date

For a legacy VME assembly, the physical board label and revision are particularly important.